D315AO 5G

Applies to NVIDIA® Jetson AGX Orin (32GB / 64GB) & AGX Orin Industrial module

1x M.2 B key for 4G & 5G, 1x M.2. E key for Wi-Fi 6E and 1x M.2. M key for SSD and capture 120-pin highspeed connector for MIPI SerDes cameras, such as GMSL2/FPD-link III/V-by-One® HS, to deploy in AMRs application 1x GbE & 1x 10G RJ-45 ethernet for dozens of IP cameras streaming simultaneously in smart security application 10GigE Vision camera connector for smart inspection and 1x PCIe slot for multi-function expansion Operating temperature: -25°C ~ 65°C Dimension: 141.5mm(W) x 133.5mm(L) x 63mm(H) Specifications    Order Information

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Introduction

AVerMedia Engineering Kit D315AO 5G built with NVIDIA® Jetson AGX Orin & AGX Orin Industrial module, which brings next-level AI performance and power-efficient capability for all autonomous machines. This optional SoM makes advanced analytics possible while providing the ability to handle a host of other embedded IoT applications.

D315AO 5G includes a 120-pin high-speed connector for connecting MIPI SerDes cameras, which can fulfill the demand for AMRs. In addition, a sufficient Ethernet bandwidth with 10G is excellent for applying smart security, enabling dozens of IP cameras to stream simultaneously. The connector for the 10GigE Vision Camera is also great for smart inspection. Lastly, with its compact size, D315AO 5G furnishes a PCIe slot for multi-function expansion and excellent compatibility with 5G and Wi-Fi 6.

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Key Industries

AVerMedia devices are built with flexibility in mind and are designed for the following verticals.

AMRs AMRs deployment relies on live camera feeds to provide a rapid and flexible adjustment for the working process and creates a significant productivity growth.

Smart Security Smart security relies on live camera feeds to benefit from the video analysis to improve and ensure community safety.

Smart Inspection Smart inspection relies on live camera feeds to benefit from fast and accurate detection to improve quality control in production.

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Specifications

Model	D315AO 5G
Type	Engineering Kit
NVIDIA GPU SoC Module Compatibility	NVIDIA® Jetson AGX Orin (32GB / 64GB) & AGX Orin Industrial module
Networking	1x GbE RJ-45 1x 10G RJ-45
Display Output	1x HDMI output
Temperature	Operating temperature -25°C ~ 65°C Storage temperature -40°C ~ 85°C Relative humidity 40°C @ 95%, Non-Condensing
MIPI Camera Inputs (Internal)	GMSL2/FPD-link III/V-by-One® HS (STURDeCAM20 optional)
USB	1x USB 2.0 Micro-B for recovery 2x USB 2.0 Type-A 2x USB 3.2 Type-A
Storage	1x micro-SD card slot
Expansion Header	40-pin (UART, SPI, CAN, I2C, I2S, GPIOs ) 1x M.2 B key (for 4G LTE module or 5G module) 1x M.2 E key (for Wi-Fi 6E) 1x M.2 M key (for SSD or AVerMedia capture card: CN311-H, CN312SW, CN312MW) 1x Micro SIM socket 1x PCIe x16 (only support x8 PCIe lanes) 1x CAN bus with transceiver 120-pin (for MIPI SerDes) OOB support (only Power ON/OFF)
Power Requirement	Voltage DC 12V~54V
	Current DC in JACK on board: 7A Max ATX 4pin: 10.8A Max
Power Cord	US/JP/EU/UK/TW/AU/CN
Thermal Solution	Fan
Buttons	Power and Recovery
RTC Battery	Support RTC battery and battery life monitoring by MCU
PCB/Electronics Mechanical Info	141.5mm(W) x 133.5mm(L) x 63mm(H) Weight: 720g
Certifications	CE, FCC, KC