Applies NVIDIA® Jetson AGX Orin
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Introduction
AVerMedia Carrier Board D317 support NVIDIA® Jetson AGX Orin , which brings next-level AI performance and power-efficient capability for all autonomous machines. This optional SoM makes advanced analytics possible while providing the ability to handle a host of other embedded IoT applications.
D317 includes a 120-pin high-speed connector for connecting MIPI SerDes cameras, which can fulfill the demand for AMRs. In addition, a sufficient Ethernet bandwidth with 10G is excellent for applying smart security, enabling dozens of IP cameras to stream simultaneously. The connector for the 10GigE Vision Camera is also great for smart inspection. Lastly, with its compact size, D315 5G furnishes a PCIe slot for multi-function expansion and excellent compatibility with 5G and Wi-Fi 6.
Key Industries
AVerMedia devices are built with flexibility in mind and are designed for the following verticals.
AMRsAMRs deployment relies on live camera feeds to provide a rapid and flexible adjustment for the working process and creates a significant productivity growth. |
Smart SecuritySmart security relies on live camera feeds to benefit from the video analysis to improve and ensure community safety. |
Smart InspectionSmart inspection relies on live camera feeds to benefit from fast and accurate detection to improve quality control in production. |
Specifications
| Model | D317 |
|---|---|
| NVIDIA GPU SoC Module Compatibility | NVIDIA® Jetson AGX Orin module |
| Networking |
1x GbE RJ-45 1x M.2 key E 2230 for wifi 6 Optional 2x 10G RJ-45 (via daughter board) (TBD) Optional 8x PoE (via daughter board) (TBD) Optional 1x M.2 Key B for 5G connection (via 5G、PoE/5G、USB/5G daughter board) (TBD) |
| Display Output | 1x HDMI output 3840 x 2160 at 60Hz |
| Temperature |
Operating temperature: -40 to 85°C (carrier board), -20 to 70°C (with fan) (TBD) Storage temperature: -40°C ~ 85°C (TBD) Relative humidity: 40 °C @ 95%, Non-Condensing |
| Camera Inputs | 1x 120pin for GMSL camera board |
| USB |
1x USB 3.2 Type-C for BSP install (supports OTG mode,when using with PoE/5G daughter board or USB/5G daughter board, the USB 3.2 OTG port becomes USB 2.0) 1x USB 3.2 Type-C (host mode only) Optional 8x USB3.2 Type-A (via daughter board) (TBD) |
| Storage | 2x NVMe M.2 Key M 2280 (1x only support S1 Type Top side component SSD) |
| TPM (Trusted Platform Module) | Built in Infineon SLB 9672 TPM Chip |
| Expansion Header |
30pin header: 1xUART, 1xI2C, 3xGPIO,1xSPI, 2xCAN BUS, 1xI2S, 5V(Maximum 0.7A), 3.3V(Maximum 0.7A) 12pin header: 1x12V(Maximum 0.7A), 1x5V(Maximum 1A), 1×3.3V(Maximum 1A) power Output, 1xUSB 2.0, 1xDMIC 16pin wafer for OOB or External Button: – OOB: 1xUART, 1xDebug UART, 1xPower button, 1xReset button, 1x Power detect (via out-of-band management module) – External Buttons: 1xPower Button, 1xReset button, 1xRecovery button, 1xPWR_LED (via external button cable) 40pin coaxial connector for 10G expansion 40pin coaxial connector for PCIe expansion |
| GPS | Optional Dual-RTK GNSS support (via daughter board) |
| Sensor | Temperature sensor for PCB top/bot Temperature measure |
| Power Requirement | Mini-Fit 4pin compatible ,12V +/- 5% DC Input |
| Thermal Solution | Fan solution (12V fan wafer) |
| Buttons | Power and Recovery |
| LED |
1x system power 1x input power |
| RTC Battery | Support RTC battery and battery life monitoring by MCU |
| PCB/Electronics Mechanical Info |
W: 92mm x L: 107mm (TBD) Weight: 1kg (TBD) |
| Certifications | CE, FCC, VCCI, KC |
| Package |
1x Carrier board Screws Nuts |
Ordering Information
| Model | SKU Number | Support NVIDIA SOM |
|---|---|---|
| D317 | D317-001 | AGX Orin 32G / 64G / industrial |