D137 Lynx Stacking Design Carrier Board

NVIDIA® Jetson Orin NX / Orin Nano For Defense-grade unmanned aircraft/Radar Applications

D137 Lynx Stacking Design Carrier Board
  • 2x Ethernet GH1.25/ 8 pin Wafer
  • 1x Micro HDMI output (HDMI 1.4, 1080P)
  • 2x 4 lane MIPI CSI-2
  • 22 pin FPC 0.5mm Pitch/GMSLCamera Inputs
  • 1x USB 2.0 Type C (For BSP Installation)
  • 3x USB 3.2 Type C
  • 1x M.2. key M 2230 forNVMe
  • XT30 DC-IN 12V~50V
  • Operating Temperature: -10°C~60°C(Board Level)
  • Dimension: 90mm (L) x 56mm (W) x 30.7mm (H) (Stacking with SOM)
Specifications

Introduction

The Carrier Board is a compact, high-density platform built around the NVIDIA® Jetson Orin NX module. Delivering AI performance in space- and weight-constrained designs. Its small size and robust layout make it well suited for defense-grade unmanned aircraft, radar and other edge systems. With native GMSL2 and MIPI CSI-2 camera interfaces, the carrier board supports flexible multi-camera configurations, from long-range zoom and low-light sensors to wide-angle situational-awareness views. This enables rich computer-vision workloads such as object detection, tracking, and perception directly at the edge.


Specifications

Model D137
NVIDIA Module Compatibility NVIDIA® Jetson Orin NX / Orin Nano
Networking 2x Ethernet GH1.25/ 8 pin Wafer (10/100/1000/Gigabit Ethernet)
Display Output 1x Micro HDMI output (HDMI 1.4, 1080P)
MIPI Camera Inputs 2x 4 lane MIPI CSI-2, 22 pin FPC 0.5mm Pitch/GMSL Camera Inputs
USB 1x USB 2.0 Type C (For BSP Installation)
3x USB 3.2 Type C
Storage 1x M.2. key M 2230 for NVMe
Expansion Connector 4x UART GH1.25/4pin Wafer
1x Expansion Power Button GH1.25/2pin Wafer
1x Expansion Suspend/Wakeup GH1.25/2pin Wafer
1x Expansion Recovery GH1.25/2pin Wafer
1x CAN Bus GH1.25/ 4 pin wafer
2x SPI GH1.25/6 pin wafer
1x PWMs*4 GH1.25/6pin Wafer
2x I2C (Master) GH1.25/4pin Wafer
1x GPIOs*8 GH1.25/10pin Wafer
RTC Battery Support RTC battery and battery life monitoring by MCU
Internal Buttons Power and Recovery and Suspend/Wakeup
Thermal Solution 4 pin Fan Wafer solution
Power Input XT30 DC-IN 12V~50V
Temperature Operating Temperature -10°C~60°C (Board Level)
PCB/Electronics Mechanical Info 90mm (L) x 56mm (W) x 30.7mm (H) (Stacking with SOM)
Weight 80g