uATX-Q670A

Micro-ATX with Intel® Q670 Chipset, support 13th/12th Generation Intel® Core™ Processors, Dual channel DDR4 memory, PCIe, 4 x COM, 12 x USB, 6 x SATA 6Gb/s

uATX-Q670A
  • Micro ATX form factor
  • Support 13th/12th Generation Intel® Core™ Processors
  • Intel® Q670 Chipset
  • Dual Channel DDR4, 4 x DIMMs
  • 1 x GbE LAN Port
  • 1 x 2.5GbE LAN Port
  • 6 x SATA 6Gb/s Ports
  • Up to 4 x PCIe expansion slots
  • 12 x USB Ports
  • 1 x COM Port (RS-232/422/485 & RI/5V/12V)
  • 3 x COM Ports (RS-232)

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    Specification   

Specifications
Form Factor Micro ATX
244W x 244D(mm)
CPU Support for 13th/12th Generation
Intel® Core™ i9/i7/i5/i3, Pentium® & Celeron® processors in the LGA1700 package
TDP under 125W
Socket 1 x LGA 1700
Chipset Intel® Q670 Chipset
Memory 4 x DDR4 DIMM sockets, Max. Capacity 128 GB
Support Dual channel DDR4 3200 MHz memory modules
Ethernet 1 x GbE LAN Port (Intel® I219LM)
1 x 2.5GbE LAN Port (Intel® I226V)
Video Integrated Graphics Processor – depends on CPU:
2 x HDMI 2.0 port, supporting a maximum resolution of 4096×2160 @60Hz
1 x DP port, supporting a maximum resolution of 4096×2160 @60Hz
1 x VGA port, supporting a maximum resolution of 1920×1080 @60Hz
1 x LVDS port, supporting a maximum resolution of 1920×1200 @60Hz

(4 independent display outputs)

Audio Realtek® ALC897
Storage 6 x SATA 6Gb/s Ports
RAID RAID 0/1/5/10
Expansion Slots 2 x PCIe x16 (Gen 4×16)
— Single at Gen 4×16 only
or
— Dual at Gen 4×8 + Gen 4×8
1 x PCIe x1 (Gen 3×1)
1 x PCIe x4 (Gen 3×4)
1 x 2280/2242 M.2 M-Key (PCIe Gen 4×4, SATA 6Gb/s)
1 x 2230 M.2 E-Key
Internal I/O 1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
1 x System fan header
1 x Front panel header
1 x Front panel audio header
1 x Case open header
6 x USB 2.0 headers
2 x USB 3.2 Gen 1 headers
3 x COM headers (RS-232)
1 x GPIO (8 bits) & SMBus header
1 x Backlight Control header
1 x Clear CMOS jumper
1 x Buzzer
1 x AT/ATX mode select jumper
Rear I/O 3 x Audio Jacks (Line in, Line out, Mic in)
2 x HDMI
1 x Display Port
1 x VGA
1 x COM Port (RS-232/422/485 & RI/5V/12V)
2 x RJ45 LAN Ports
2 x USB 3.2 Gen 2×1
2 x USB 3.2 Gen 1
TPM 1 x TPM header (SPI)
OS Compatibility Windows 10/11 (x64)
Operating Properties Operating temperature: 0°C to 60°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Optional Kit CPU Cooler : 12SF1-SK1700-01R (For CPU TDP 125W, Push-pin type)
CPU Cooler : 25ST0-037820-Y0R (For CPU TDP 65W)
CPU Cooler Backplate : 12KRH-0A1700-00R (Used with P/N: 25ST0-037820-Y0R)
TPM 2.0 module : 9CTM010NR-00
VR Heatsink : 12SP2-090027-00R (Suggest to be used if CPU real power is over 100W)