Compact LWIR Thermal Camera Core
The Boson® longwave infrared (LWIR) thermal camera module sets the standard for size, weight, power, and performance (SWaP). Utilizing FLIR’s advanced image processing and several industry-standard communication interfaces, Boson enables applications from firefighting to unmanned aerial vehicles and automotive development kits, all for as little as 800mW. The 12 µm pitch Vanadium Oxide (VOx) uncooled detector comes in two resolutions – 640 × 512 or 320 × 256. Both resolutions are available with multiple lens configurations, adding flexibility to integration programs. Radiometric models are also available with absolute temperature measurement in select configurations.

| Thermal Imager | FLIR Boson | |
| Sensor Technology | Uncooled VOx Microbolometer | |
| Array Format | 320 × 256 or 640 × 512 | |
| Pixel Pitch | 12 μm | |
| Spectral Range | Longwave infrared: 7.5 µm – 14 µm | |
| Thermal Sensitivity | <40 mK (Industrial); <50 mK (Professional); <60 mK (Consumer) | |
| Full Frame Rate, Slow Frame Rate | 60 Hz baseline; 30 Hz runtime selectable, ≤9 Hz available | |
| Radiometric Temperature Measures | Available in some models | |
| Non-uniformity Correction (NUC) | Factory calibrated; updated FFCs with FLIR Silent Shutterless NUC (SSN™) | |
| Solar Protection | Integral | |
| Continuous Electronic Zoom | 2X zoom | |
| Symbol Overlay | Re-writable each frame; alpha blending for translucent overlay | |
| Optics | ||
| Array Format Horizontal Field of View (HFOV); Effective Focal Length |
320 × 256 | 640 × 512 |
| 92°; 2.3 mm | 95°; 4.9 mm | |
| 50°; 4.3 mm | 50°; 8.7 mm | |
| 34°; 6.3 mm | 32°; 14 mm | |
| 24°; 9.1 mm | 24°; 18 mm | |
| 16°; 14 mm | 18°; 24 mm | |
| 12°; 18 mm | 12°; 36 mm | |
| 6°; 36 mm | 8.0°; 55 mm | |
| 4°; 55 mm | 6°; 73 mm | |
| Physical Attributes | ||
| Size | 21 × 21 × 11 mm (0.83 x 0.83 x 0.43 in) without lens or 640-model shutter | |
| Weight | 7.5 g (0.26 oz) without lens or 640-model shutter | |
| Precision Mounting Holes | Four tapped M160.35 (rear cover) Lens support recommended when lens mass exceeds 7.5 g |
|
| Interfacing | ||
| Input Voltage | 3.3 VDC | |
| Power Dissipation (Peak) | Varies by configuration; as low as 500 mW | |
| Video Channels | CMOS or USB-2 | |
| Control Channels | UART or USB | |
| Configurable GPIO | Up to 11; user configurable | |
| Environmental | ||
| Operating Temperature Range | -40°C to 80°C (-40°F to 176°F) | |
| Non-Operating Temperature Range | -50°C to 105°C (-58°F to 221°F) | |
| Shock | 1,500 g @ 0.4 msec | |
| Operational Altitude | 12,192 m (40,000 ft) | |