Boson Plus IQ Development Kit

Boson+ IQ Development Kit - Qualcomm

Boson Plus IQ Development Kit

The Boson®+ IQ Development Kit is a reference hardware design and software development platform that enables integrators to evaluate and develop thermal infrared (IR) sensing with AI object detection and image signal processing (ISP) at the edge. Based on the Teledyne FLIR AVP, featuring a Qualcomm® Dragonwing™ QCS8550 system on chip (SoC), it delivers industry-leading 50 trillion operations per second (TOPS) calculation performance. The multicore architecture features two DSP cores for inference, 8 CPU cores for general compute, and a GPU for computational imaging functions. The typical power addition is just 2.5 watts, simplifying thermal management and maximizing future mission duration while operating Prism™ AI object detection models and Prism ISP denoising, super resolution, and automatic gain control (AGC) for superior image quality.

Engineered with integrators in mind, the Boson+ IQ Development Kit simplifies integration with three MIPI interfaces for the included Boson+ thermal camera module and additional cameras. The software development kits (SDK), hardware ICD, and comprehensive expert-level engineering support ensure a seamless development experience. The platform is also forward-compatible with future Prism software enhancements, such as Prism SKR and more, making it a future-ready solution for edge AI thermal imaging applications.

Evaluate and develop thermal with Edge AI

EVALUATE AND DEVELOP THERMAL WITH EDGE AI

Access Prism software IR object detectors, advanced ISP, and future additions.

  • Prism AI real time decision support detection and multi object tracking
  • Prism ISP imaging with super-resolution, noise reduction, and more
  • Future compatibility with visual navigation and Prism SKR autonomous target detection
  • 16-bit real-time recording for offline video pipeline and AI model development
Develop on the Qualcomm Dragonwing QCS8550 platform

DEVELOP ON THE QUALCOMM DRAGONWING QCS8550 PLATFORM

Premium processor enables extreme edge AI at low power.

  • Industry-leading 50 TOPS total compute
  • Low 2.5 W input power and thermal load running 100% DSP, 60% GPU, and two CPU cores
  • 640x512 Boson+ thermal camera module interface
  • Three MIPI interfaces for two thermal and one visible camera
Designed for integrators

DESIGNED FOR INTEGRATORS

Simplify development and reduce risk with software and support.

  • Boson+ and Prism SDKs
  • 640x512 Boson+, MIPI interface board, cable, and carrier board
  • User-friendly graphical user interface (GUI)
  • Development support by qualified application engineers

Specifications

Imaging & Optical
Frame Size / Rates 640 x 512 / 30Hz (typical) to 60Hz (configuration dependent)

1280 x 1024 w/ Super Resolution / 30Hz (typical) to 60Hz (configuration dependent)
Pixel Pitch 12 µm
Resolution Boson+ 640x512 (32° HFOV) w/ shutter
Mechanical
Dimensions w/ Enclosure Assembly (w/o Boson+) 54 mm x 52 mm x 57 mm
Weight w/ Enclosure Assembly (w/o Boson+) 90 g
Export Designations
ECCN Code 6A003.b.4.b (Fast Video, 60Hz)
Connections & Communications
Video Input - Thermal Camera Module MIPI 2-lane CSI-2 (D-PHY)
Video Inputs - Camera 2 and 3 MIPI 4-lane CSI-2 (D-PHY)
Electrical
Input Voltage 5 - 36 VDC (12 VDC nom)
Power Consumption 2.5 W (100% DSP, 60% GPU load, and two CPU cores)
4 W (typical w/ Boson+)
Environmental & Approvals
Compliance and Certifications NDAA Compliant

Fabrication Quality Assurance Boards assembled to IPC-A-610 Class 2 specifications by an ISO 9001 and AS 9101 certified facility

ROHS directive 2011/65/EU and 2015/863/EU compliant materials and processes
Operating Temperature Range -40°C to 60°C